New T.I. 3D DLP Chipset
Texas Instruments (USA) unveiled last month a new family of image processing chips designed for front projectors, which enable broader standardization of 3D and interactive technologies. Projectors with the new chipset design, which will be incorporated in shipping units starting late summer 2012, will seamlessly display content from common 3D-formats supported by HDMI 1.4, from virtually any mobile device including tablets, smart phones, laptops and Blu-ray players.
Panasonic offers the first product with this new chip.
A microscopic close up of the switching mirrors. Millions of these sit on one 20 x 20mm HD Projector chip.
TI Representative Interview at InfoComm
“Creating a chipset that makes 3D and interactive technologies more accessible for projector developers is a major step forward for the industry,” said Roger Carver, General Manager, DLP Front Projection. “This helps our customers build off-the-shelf projectors while adding new capabilities at a comparable price point that allows for global deployment while still serving unique regional needs”.
The new chipset also helps facilitate the shift to lamp-free light sources by incorporating features designed specifically for solid state deployment, enabling a wider range of manufacturing options. “The display industry has evolved beyond the days of the higher resolution chase and the brightness battles,” added Carver. “As projectors increasingly become the central hub of the classroom, this new chipset will help optimize hardware and software for the new frontiers of interoperability, 3D and interactive display”.
As the adoption of lamp-free, 3D and interactive technologies continues to increase in the classroom, ease of connectivity and deployment is another major benefit of the new chipset, allowing end users to run downloadable content from a laptop, tablet or other mobile device, while still supporting standard formats like Blu-ray and DVD, enhancing the ability of teachers to transition between content sources.